84N

84N

PCB Laminates by Arlon EMD (17 more products)

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The 84N from Arlon Electronic Materials is a Ceramic-Filled Polyimide Prepreg that is based on Arlon’s 85N pure polyimide system. It is designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formulation during through-hole drilling in filled clearance areas. It meets the IPC4101/40 and /41 description and specification and provides excellent thermal properties with Tg of 250°C and a decomposition temperature of more than 407°C. This prepreg has low Z-axis expansion which minimizes the risk of latent PTH defects caused during solder reflow and device attachment.

The 84N is suitable for use in PCB's that are subjected to high temperatures during processing, such as lead-free soldering, HASL, IR reflow. It can also be used in applications with long term exposure to high temperatures such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors.

Product Specifications

Product Details

  • Part Number
    84N
  • Manufacturer
    Arlon EMD
  • Description
    Ceramic-Filled Polyimide Prepreg High-Temperature Applications

General Parameters

  • Dk
    4.2
  • Df
    0.01
  • Tg
    250 Degree C
  • Frequency
    0.1 to 1 GHz
  • Lead Free
    yes
  • Arc resistance
    143 Sec
  • Cte xy
    16 ppm/Degree C
  • Cte z
    48, 150 ppm/Degree C
  • RoHS
    Yes
  • Dielectric breakdown
    41 kV
  • Electrical strength
    1451 (57.1) kV/mm (V/mil)
  • Flamibility
    HB class
  • Industry application
    Industrial, Aerospace and defence,Automative
  • Material
    Polyimide, Ceramic
  • Peel strength
    7.1 (1.2), N/mm (lb/inch)
  • Size
    305 x 457, 406 x 457, 457 x 610 mm
  • Surface resistivity
    1.6 x 10^9, 1.6 x 10^8 Mohm
  • Thermal conductivity
    0.25 W/mK
  • Volume resistivity
    1.5 x 10^8, 3.0 x 10^8 Mohm-cm
  • Water absorption
    0.0027
  • Youngs modulus
    4.1 (28.2) Mpsi (Gpa)

Technical Documents

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