TSM-DS3

TSM-DS3

PCB Laminates by AGC Inc (54 more products)

Note: Your request will be directed to AGC Inc

The TSM-DS3 from AGC Inc is a PCB Laminates with Dk 3, Df 0.0011, Td 526 to 551 Degree C, Frequency 0 to 10 GHz. More details for TSM-DS3 can be seen below.

Product Specifications

Product Details

  • Part Number
    TSM-DS3
  • Manufacturer
    AGC Inc

General Parameters

  • Dk
    3
  • Df
    0.0011
  • Td
    526 to 551 Degree C
  • Frequency
    0 to 10 GHz
  • Lead Free
    yes
  • Cte xy
    10, 16 ppm/Degree C
  • Cte z
    23 ppm/Degree C
  • Flexural strength
    1860 N/mm2
  • Industry application
    Aerospace and defence, Telecom
  • Material
    PTFE, Ceramic
  • Moisture absorbtion
    0.0007
  • Peel strength
    8 N/mm
  • Surface resistivity
    2.3 x 10^6, 2.1 x 10^7 Mohm
  • Thermal conductivity
    0.65 W/m・K
  • Volume resistivity
    1.1 x 10^7, 1.8 x 10^8 Mohm-cm
  • Youngs modulus
    973000 N/mm2, 984,000 984,000

Technical Documents

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