3Di-LS3

The 3Di-LS3 from Saki Corporation is a Single-Lane Automated Optical Inspection (AOI) equipment that supports PCB sizes from 50 x 60 mm to 500 x 510 mm. This AOI machine has a resolution of 8 μm and enables inspection for high-density and ultra-small SMD-chip components (such as  0402 and 0201 mm) as well as fine-pitch ICs and closely spaced solder pads. It has a height measurement range of up to 40 mm that ensures high  quality inspection for a variety of surface-mounted and through-hole components. It utilizes advanced processing hardware to capture more data in each field of view, which increases the image-processing workload and can cause cycle time to be extended. With Saki’s own in-house team of inspection-software experts, this AOI machine ensures optimal processing performance and coordination with hardware engines, resulting in a total time of capturing and inspection of 15 sec for an A5 size board (150 x 214 mm).

The 3Di-LS3 provides flexibility to upgrade the camera system for the production environment and characteristics of the products. The highly stable and durable gantry ensures sustained accuracy and permits continues option upgrades to be applied on-site in a very short time.