Summit Interconnect’s Tailored PCBs for the Automated Test Equipment (ATE) Market in Semiconductor Chips

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Summit Interconnect is a pioneering supplier of Printed Circuit Boards (PCBs) tailored for the Automated Test Equipment (ATE) market in semiconductor chips. These ATE boards, characterized by their complexity and high-layer counts of 40 to 60 and beyond, demand top performance and reliability.

Efficiency at Its Core: Summit Interconnect's PCB solutions prioritize efficiency, enabling customers to streamline testing processes and achieve swift, reliable results. With advanced technologies and specialized expertise, Summit ensures significant time savings without compromising accuracy.

Specialized Expertise: Focused solely on the Semiconductor ATE market, Summit boasts unmatched knowledge and experience. From reference design test boards to high aspect ratio ATE boards, Summit's capabilities cater to the unique requirements of semiconductor testing.

Advanced Capabilities: Summit's semiconductor capabilities include features like bondable gold finishes, tight tolerance drilling/routing, and copper balancing, all designed to optimize performance and signal integrity. Quick turnaround services ensure timely delivery without sacrificing quality.

A printed circuit board should be designed with balanced copper in mind. Copper balancing is necessary to achieve consistent flatness of the finished Printed Board. It also improves manufacturing yields by providing balanced copper plating distribution across each layer of the PCB. Balanced plating improves the consistency of through-hole copper plating thickness and helps support the creation of uniform conductor and land thickness on plated layers. On inner layers, copper balancing helps to maintain dielectric thickness. Uniformity of the inner layers creates consistent overall thickness across the PCB. It reduces low-pressure areas of the PCB that if not corrected can result in processing issues and require a redesign.

Click here to learn more about Summit Interconnect.