Summit Interconnect Offers Rigid PCB Manufacturing for Multi-Layer or HDI Designs

Summit Interconnect Offers Rigid PCB Manufacturing for Multi-Layer or HDI Designs712370

In the dynamic world of electronics, where innovation drives progress, Summit Interconnect stands as a beacon of excellence in rigid PCB manufacturing. With over 30 years of experience, Summit's integrated network of fabrication facilities offers a comprehensive range of solutions, from standard to complex designs, meeting the exacting demands of modern electronic products.

Summit Interconnect Offers Rigid PCB Manufacturing for Multi-Layer or HDI Designs

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Tailored Solutions for Every Need

Whether you require 2 or 4-layer boards or intricate HDI designs, Summit's seasoned teams have the expertise to bring your visions to life. Operating in alignment with IPC standards, Summit ensures that every PCB manufactured meets the highest quality and reliability standards. But Summit goes beyond mere compliance; they collaborate closely with clients, pushing the boundaries of innovation to deliver truly remarkable electronic solutions.

Embracing High-Density (HDI) PCBs

As the complexity of electronic devices continues to soar, the demand for high-density circuit boards (HDI) has become imperative. With shrinking form factors and escalating functionality requirements, traditional PCB designs no longer suffice. Summit Interconnect rises to this challenge, leveraging its expertise and cutting-edge HDI technology to accommodate the most intricate designs.

HDI designs by Summit encompass a plethora of advanced features, including through vias from surface to surface, buried vias with through vias, multiple HDI layers with through vias, laser drill micro vias, and passive substrates with no electrical connection. These innovations allow for maximized space utilization and enhanced functionality without compromising on performance.

Unrivaled Capabilities

Summit Interconnect's rigid PCB capabilities are truly comprehensive, catering to a diverse array of requirements. With multiple material options and surface finishes, including blind, buried, and micro via structures, stacked and staggered micro vias, backdrilling, multiple sequential laminations, and via fill (both conductive and non-conductive), Summit ensures that every aspect of your design is meticulously addressed.

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Click here to learn more about Summit Interconnect, a Partner for Rigid PCB Manufacturing.

Summit Interconnect Offers Rigid PCB Manufacturing for Multi-Layer or HDI Designs

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