Substrate-Like (SLP) PCB Solutions by TTM Technologies for Unparalleled Reliability and Performance

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In the realm of semiconductor packaging solutions, innovation is a necessity. TTM Technologies proudly presents its Substrate-Like (SLP) PCB solutions, heralding a new era of high-performance, cost-effective technology poised to revolutionize various industries.

The Glue That Holds It All Together

For industries demanding unparalleled reliability and performance—think aerospace, defense, space, medical, and telecommunications—TTM's SLP solutions emerge as the glue binding diverse requirements seamlessly. These solutions cater to multi-layer, RF, and chip-on-flex needs, aligning perfectly with the low-loss, high-speed prerequisites of critical applications.

HyperBGA: Pushing Boundaries

Enter HyperBGA, the epitome of speed and reliability in semiconductor packaging. Crafted from low-loss, low-dielectric constant materials, this coreless semiconductor package is engineered to elevate signal speeds to unprecedented levels. Surpassing 25 GHz with ease and capable of reaching over 70 GHz in shorter distances, HyperBGA is the go-to solution for networking, high-end servers, telecommunications, military, and medical sectors. Its blend of performance, reliability, and miniaturization—reducing size, weight, and power (SWaP)—makes it indispensable for critical applications.

CoreEZ: Redefining Efficiency

Building upon the HyperBGA platform, CoreEZ emerges as the pinnacle of cost-effective innovation. Its thin core build-up flip-chip package boasts a density that defies convention, offering 199-micron via-to-via core pitch—a feat made possible by its essentially coreless structure. With up to twice the signal layers compared to standard build-up packages, CoreEZ delivers unparalleled wireability and performance while keeping costs in check. Its thin core design not only enhances power distribution but also enables efficient thermal dissipation, making it an ideal choice for applications demanding reliability, performance, and affordability.

Powering the Future

With Substrate-Like (SLP) PCB solutions by TTM Technologies, the future of semiconductor packaging has arrived. Whether it's the groundbreaking speed of HyperBGA or the efficiency-driven design of CoreEZ, these solutions stand as testaments to innovation and reliability. In industries where every nanosecond counts and every ounce saved matters, TTM's SLP solutions emerge as the driving force propelling progress into uncharted territories. Experience the future today with TTM Technologies' SLP PCB solutions.

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