Streamlining Electronic Systems with Back Panel PCB Manufacturing by iCape Group

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Back Panel PCBs: Centralizing and Interconnecting Electronic Systems

Back-panel PCBs are pivotal components in electronic systems, acting as centralized interconnect infrastructures that streamline wiring complexities and facilitate efficient communication between individual PCBs.

Key Product Benefits:

• Backbone Functionality: Back-panel PCBs serve as the backbone of electronic systems, providing a centralized point of connection for various modules and PCBs. They facilitate fast and efficient communication between active sub-boards without containing any active components themselves.
• Simplified Assembly: These PCBs primarily feature connectors for interconnecting sub-boards, which can be press-fitted, surface-mounted, or through-hole mounted, ensuring ease of assembly.
• Superior Reliability: Back-panel technology offers superior reliability and high-speed connectivity compared to alternative interconnection solutions, ensuring robust performance in demanding applications.

Materials and Specifications:

• Material Considerations: Back-panel PCBs are typically constructed from dedicated high-speed materials with low loss tangent (DF) and relative dielectric constant (DK), enabling impedance-controlled signal interconnection.
• Impedance-Controlled Traces: These PCBs often require fine traces with sizes as small as 62, 75, or 100 microns, achieved through advanced manufacturing techniques such as laser direct imaging (LDI) and vacuum Develop-Etch-Strip (DES) lines.
• Layer Count and Surface Finish: Back-panel PCBs can feature up to 60 layers, with surface finish options including HASL, LF HASL, OSP, ENIG, Immersion Sn, or Immersion Ag, depending on the connector assembly method.

Active vs. Passive Back-Panel Systems:

• Active vs. Passive Distinction: Back-panel systems can be categorized as active or passive. Active back panels contain circuitry to manage communication between slots, while passive back panels lack computing circuitry and primarily serve as connection interfaces.

Thick, Rigid, and Multi-Layered:

• Structural Considerations: Back-panel PCBs are thick, rigid, and multi-layered to support the interconnection of multiple sub-boards within rack systems. This structural robustness ensures stability during the insertion of sub-boards into connectors.

Back Panel PCBs are indispensable components in larger computing and server systems, providing a robust mechanical platform for low-ohm, high-speed interconnections between sub-boards. iCape Group offers comprehensive manufacturing capabilities to meet the diverse requirements of back-panel PCB applications, ensuring optimal performance and reliability in complex electronic systems.

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