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LaserMicronics, a leading provider of laser processing solutions, is pioneering a breakthrough in the production of printed circuit boards (PCBs) with their advanced laser drilling services. Specializing in the creation of vias and blind vias on sophisticated PCBs, LaserMicronics caters specifically to circuit board manufacturers requiring micro vias with diameters as small as 50 μm or larger.
Contact LaserMicronics (LPKF Group) to learn more.
Microvias Precision
In the realm of High-Density Interconnect (HDI) technology, connecting components demands microscopic precision. Laser Micronics utilizes state-of-the-art UV laser technology to drill microvias in a range of materials including RCC, FR4, FR5, Teflon, and Thermount. This cutting-edge process ensures that both the top copper layer and underlying epoxy resin and fiberglass substrates are pierced in a single operation, with unparalleled precision. Unlike traditional CO2 and hybrid laser systems, LaserMicronics' approach eliminates the need for upstream etching processes or secondary lasers, streamlining production without sacrificing quality.\
Advantages of UV Laser Drilling
The advantages of Laser Micronics' UV laser drilling are manifold:
In summary, Laser Micronics' Laser Drilling services represent a quantum leap forward in PCB manufacturing. By leveraging UV laser technology, they offer unparalleled precision, versatility, and quality, making them the go-to choice for circuit board manufacturers seeking to push the boundaries of what's possible in modern electronics.
Click here to learn more about LaserMicronics.
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