ICAPE Groups’s IC Substrate-Like PCBs (SLP) with Ultra-Fine Line Down to 30/30 µm

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Established as a leading manufacturer of Printed Circuit Boards and customized technical parts, ICAPE Group announces the launch of its latest innovation in Southeast Asia and North America: IC substrate-like PCBs (SLP). SLP is an integrated part of the IC packaging or module used to connect the chip with the PCB motherboard. SLP Technology development is mainly driven by the mobile phone and wearable electronic device industries, and it is a rapidly growing market.

An IC substrate-like PCB (SLP), also known as an IC carrier board, is a type of printed circuit board that is specifically designed to hold integrated circuit (IC) chips. It is an ultra HDI PCB used in the semiconductor industry to package and connect IC chips to the rest of the electronic system.

Designed with an ultra HDI PCB architecture, SLP boasts ultra-fine line/space down to 30/30µm, setting a new standard for HDI PCB production. This breakthrough is made possible by leveraging advanced BT (Bismaleimide Triazine) resin material, renowned for its high Tg of 250 to 300°C and low X&Y CTE of 2-5 ppm/°C. Unlike traditional FR4 materials, BT resin ensures exceptional reliability and integration with IC substrates, making SLP ideal for Modules or Systems in Packages (SIP) with high-density designs.

The key to SLP's success lies in its ability to provide enhanced connectivity and versatility. Featuring 2-6 layers of conductive traces, laser-defined vias, and pads, ICAPE’s SLP facilitates seamless electrical connections between IC chips and the PCB. This not only improves the performance and functionality of electronic devices but also reduces the overall footprint, making SLP an ideal solution for compact designs. Furthermore, SLP's compatibility with a wide range of IC chips and components ensures its versatility across diverse applications in industries such as mobile phones and wearable electronic devices.

IC Substrate Structure

There are 3 different process methods.

1. Tenting: A subtractive process using thin start Cu foil of 9-12µm and production steps using panel plating. 35/35µm Line & Space possible.
2. mSAP: A modified semi-additive process using ultra-thin start Cu foil of 1,5µm and production steps using chemical Cu plating + pattern plating process and flash etching. 20/20µm Line & Space possible.
3. SAP: Semi-additive process using special material without base Cu. and production steps using chemical Cu plating + pattern plating process and flash etching. 15/15µm Line & Space possible. (The SAP method can create up to 12 layers, but it is only available for mass production.)