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In the fast-paced world of electronics, staying ahead often means making the most of smaller components. That's where HDI (High-Density Interconnect) PCBs come into play. Imagineering Inc. leverages HDIs to achieve a higher wiring density per unit area, enabling the utilization of smaller, future-driven components on a wide scale. These advanced interconnects offer not only faster signal transmission but also significantly reduced signal loss and crossing delays, making them the ideal choice for shrinking down PCB sizes without compromising performance.
Contact Imagineering, Inc. to learn more.
At the heart of their HDI technology lies a plate-shut process, ensuring enhanced reliability for micro via processes compared to traditional methods filled with non-conductive ink and plate over. Their micro via formation technology utilizes state-of-the-art lasers to drill micro vias, also known as blind via-holes (BVHs). These holes, capable of being placed on or off the pads, allow for selective creation of routing room in denser parts of the substrate, offering unprecedented flexibility in design.
The benefits of HDIs are manifold:
Imagineering Inc. understands the critical role that HDI PCBs play in pushing the boundaries of electronics design. With expertise and advanced manufacturing capabilities, they empower clients to realize their most ambitious projects with precision, reliability, and innovation.
Click here to learn more about Imagineering Inc.
Click here to learn more about High-Density Interconnects by Imagineering Inc.
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