ICAPE Group Offers Back Panel PCB Manufacturing Capabilities for Complex Electronics Systems

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Back Panel PCBs serve as the backbone of electronic systems, providing a centralized interconnect infrastructure for efficient communication between various PCBs and electronic modules. The ICAPE Group, offers comprehensive manufacturing capabilities for Back Panel PCBs, ensuring high-quality and reliable solutions for complex electronic systems.

Product Benefits:

The Back Panel PCBs serve as a single point of connection for electronic modules and daughterboards, simplifying the wiring and interconnect requirements of complex systems. They feature high-speed traces, connectors, and power distribution planes to facilitate fast and efficient communication between active sub-boards. Additionally, these Back Panel PCBs are designed for ease of assembly, primarily utilizing connectors for interconnection, which can be Press-fitted, SMT-mounted, or THT-mounted.

Reliability and Material Selection:

Back Panel technology ensures superior reliability and high-speed connectivity compared to other interconnection module solutions. ICAPE utilizes a wide range of materials, including high-speed materials with low loss tangent (DF) and dielectric constant (DK), to support high-speed impedance-controlled signal interconnections between active sub-boards.

Specifications:

Our Back Panel PCBs adhere to stringent specifications, including fine trace and spacing widths as small as 0.0025 inches, mechanically drilled vias with minimum sizes of approximately 0.3mm, and layer counts of up to 60 layers. They recommend using mid or high-Tg materials for Back Panel PCBs, along with surface finishes tailored to the connector assembly method, such as HASL, LF HASL, Immersion Sn, ENIG, or Immersion Ag.

Active or Passive Back Panels:

ICAPE offers both active and passive Back Panel systems to meet diverse application requirements. Active Back Panels contain the necessary circuitry to manage and control communication between slots, while passive Back Panels serve primarily as interconnect infrastructure without computing circuitry.

Thick and Rigid Construction:

The Back Panel PCBs are thick and rigid, designed to support and interconnect multiple sub-boards in rack systems. The considerable size and high layer count ensure mechanical robustness and stiffness, essential for supporting insertion force during sub-board plugging.

In conclusion, Back Panel PCBs manufactured by The ICAPE Group provide a firm and robust mechanical platform for low-ohm high-speed interconnection between sub-boards in complex electronic systems. Whether for consumer electronics, automotive applications, or industrial machinery, their expertise and one-stop solutions cater to a diverse range of industries, ensuring quality and reliability at every step of the manufacturing process.

Click here to learn more about the ICAPE Group.