ASC's Cutting-Edge Ultra High-Density Interconnect PCBs

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American Standard Circuits (ASC) stands at the forefront of the North American electronics industry, pioneering the development and implementation of cutting-edge technology for printed circuit boards (PCBs) requiring ultra high density interconnects.

As an early adopter of Averatek Corporation’s patented A-SAP Technology, ASC has positioned itself as a leader in producing Ultra-Fine Lines and Spaces in various board technologies, including Rigid, Flex, and Rigid-Flex. With the ability to achieve line widths down to 25 microns, ASC is poised to push the boundaries further in 2023, aiming to reach the remarkable 15-micron range.

Utilizing Averatek Corporation’s Semi-Additive Process (A-SAP), ASC employs a unique fabrication technique to manufacture ultra-fine line traces and spaces, offering a range of design advantages:

• Size and Weight Reduction: ASC's technology enables significant reductions in size and weight compared to current state-of-the-art solutions, with the capability to build down to 20 microns (0.8 mil) trace and space, and even finer dimensions on the horizon.
• Tight Spacing and Impedance Control: Maintaining tight spacing and impedance control (< 5%) across all line widths, including 3 mils and above, ensures optimal performance.
• Reduced Layer Count and Microvias: By minimizing layer count, microvias, and lamination cycles, ASC enhances reliability and reduces complexity.
• Aspect Ratios and Signal Integrity: ASC achieves aspect ratios greater than 1:1 for metal traces, contributing to improved signal integrity.
• RF Performance: The technology surpasses traditional subtractive-etch processes in RF performance.
• Biocompatibility: Offering biocompatibility, ASC allows the use of gold and other noble metals as conductive materials, eliminating the need for copper or nickel.
• Cost Reduction: Particularly beneficial for complex, high-performance boards, ASC’s approach significantly reduces costs.

ASC’s Ultra High-Density Interconnect program boasts an impressive array of capabilities:

• Line Widths and Spaces: Capable of achieving 25-micron lines and spaces, with sub-25 micron capabilities forthcoming.
• Board Types: Suitable for a variety of board types, including Rigid, Flex, and Rigid-Flex.
• Material Compatibility: Compatible with all material types, ensuring versatility and adaptability.
• Hybrid Constructions: Offering hybrid constructions, ASC blends ultra-fine line features with standard technology on different layers.
• Microvias: Microvias up to 75 microns with copper filling are supported.
• Impedance Tolerances: Tight impedance tolerances ensure consistent and improved signal integrity.

In summary, ASC's Ultra High-Density Interconnects represent a paradigm shift in PCB technology, offering unparalleled miniaturization, reliability, performance, and versatility for a wide range of applications in the electronics industry.

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Click here to learn more about Ultra-high density interconnects by ASC.