What is Via in Pad?

‘Via in Pad’ is when the via is placed directly on the pad of a surface mount component. Once this is done, the via is filled with conductive or non-conductive epoxy, followed by capping and electrochemical plating to make it virtually invisible. Such type of arrangement results in buried via within the PCB surface that can be completely soldered as standard SMT lands.

The Via in Pad can be filled using non-conductive epoxy, conductive epoxy, copper, or silver followed by electrochemical plating. Click here to learn more about via filling.